Mechanical behavior of Cu-W interface systems upon tensile loading from molecular dynamics simulations

被引:40
|
作者
Ma, G. C. [1 ]
Fan, J. L. [1 ]
Gong, H. R. [1 ]
机构
[1] Cent S Univ, State Key Lab Powder Met, Changsha 410083, Hunan, Peoples R China
基金
中国国家自然科学基金;
关键词
Cu-W interface; Dislocations; Stress-strain behavior; SOLID-SOLUTIONS; MULTILAYERS; NANOCOMPOSITES; TEMPERATURE; COMPOSITE; DUCTILITY; CRYSTALS; ENERGY;
D O I
10.1016/j.commatsci.2018.05.030
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Molecular dynamics simulations reveal that compared with Cu, the Cu/W interface with the Kurdjumov-Sachs relationship possesses higher critical strength in the [1 1 (2) over bar](Cu) or [(1) over bar 1 0](Cu) direction and much lower strength in the [1 1 1](Cu) direction, while its ductility is smaller, mainly due to constraints of the interface and W lattice. The evolution of Shockley partial dislocations of Cu/W interface has a strong correlation with the direction of tensile loading, and three edge dislocations appear in the [1 1 1](Cu) direction, while two and one mixed dislocations in the [1 1 (2) over bar](Cu) and [(1) over bar 1 0](Cu) directions, respectively. The obtained results are discussed and compared to provide a deep understanding of the stress-strain behavior and dislocation evolution of the Cu/W interface.
引用
收藏
页码:165 / 168
页数:4
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