A new form of the non-linear compact thermal model of the IGBT

被引:7
作者
Gorecki, Krzysztof [1 ]
Gorecki, Pawel [1 ]
机构
[1] Gdynia Maritime Univ, Dept Marine Elect, Gdynia, Poland
来源
PROCEEDINGS 2018 IEEE 12TH INTERNATIONAL CONFERENCE ON COMPATIBILITY, POWER ELECTRONICS AND POWER ENGINEERING (CPE-POWERENG 2018) | 2018年
关键词
IGBT; compact thermal model; self-heating; measurements; modelling; POWER; RESISTANCE; SIMULATION; DEVICES;
D O I
10.1109/CPE.2018.8372563
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
This paper presents a new form of the non-linear compact thermal model of the IGBT. In this model, which has a form of the electrical network, the influence of the internal temperature of this transistor on efficiency of heat dissipation is taken into account. The form of this model is presented, the method of estimation parameters of this model is described and some results of experimental verification of the presented model are shown.
引用
收藏
页数:6
相关论文
共 30 条
[21]  
Masana FN, 2015, 2015 22ND INTERNATIONAL CONFERENCE MIXED DESIGN OF INTEGRATED CIRCUITS & SYSTEMS (MIXDES), P204, DOI 10.1109/MIXDES.2015.7208511
[22]   Physically based compact device models for circuit modelling applications [J].
Mawby, PA ;
Igic, PM ;
Towers, MS .
MICROELECTRONICS JOURNAL, 2001, 32 (5-6) :433-447
[23]   SIMULATION OF POWER ELECTRONIC AND MOTION CONTROL-SYSTEMS - AN OVERVIEW [J].
MOHAN, N ;
ROBBINS, WP ;
UNDELAND, TM ;
NILSSEN, R ;
MO, O .
PROCEEDINGS OF THE IEEE, 1994, 82 (08) :1287-1302
[24]  
Oettinger F. F., 1992, Semiconductor measurement technology: thermal resistance measurements
[25]   THERMAL CHARACTERIZATION OF POWER TRANSISTORS [J].
OETTINGER, FF ;
BLACKBURN, DL ;
RUBIN, S .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1976, 23 (08) :831-838
[26]  
Perret R., 2009, Power Electronics Semiconductor Devices
[27]  
Rashid M.H., 2017, SPICE POWER ELECT EL
[28]  
Rashid MH, 2007, POWER ELECTRONICS HANDBOOK: DEVICES, CIRCUITS, AND APPLICATIONS, 2ND EDITION, P1
[29]   A new evaluation method of thermal transient measurement results [J].
Szekely, V .
MICROELECTRONICS JOURNAL, 1997, 28 (03) :277-292
[30]   The Electrothermal Large-Signal Model of Power MOS Transistors for SPICE [J].
Zarebski, Janusz ;
Gorecki, Krzysztof .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2010, 25 (05) :1265-1274