Low-cost optical sub-assemblies for metro access applications

被引:7
作者
Hogan, WK [1 ]
Wolf, RK [1 ]
Shukla, A [1 ]
Deane, P [1 ]
机构
[1] JDS Uniphase, Transmiss Prod Grp, Rochester, MN USA
来源
54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS | 2004年
关键词
D O I
10.1109/ECTC.2004.1319338
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The fiber optic communications industry is experiencing significant change as datacom 10 Gb/s Ethernet (10GbE) networks merge with telecom SONET 10G networks in the drive to reach metro access applications. Lower data rate (1G Ethernet, 1G & 2G Fiber Channel, and SONET OC-48) applications have already merged to some extent as various versions are available within the SFF [1] or SFP standard transceiver form factors. Traditional 10 Gb/s optical subassemblies (OSAs), developed for SONET OC-192 applications, used variations of the expensive butterfly type package However, smaller form factor modules (such as the XFP that use SFF optical connectors [2] and LC duplex optical connectors) require much smaller OSAs. To meet the size limitation of packaging 10G OSAs into the XFP transceiver and also meet the 10 GbE market challenge of providing low-cost solutions, new 10 Gb/s OSA components are needed.
引用
收藏
页码:203 / 207
页数:5
相关论文
共 7 条
  • [1] *ANS CORP, 2002, HIGH FREQ STRUCT SIM
  • [2] BAKS C, 2004, P 54 EL COMP TECHN C
  • [3] Failure mechanism of avalanche photodiodes in the presence of water vapor
    Comizzoli, RB
    Osenbach, JW
    Crane, GR
    Peins, GA
    Siconolfi, DJ
    Lorimor, OG
    Chang, CC
    [J]. JOURNAL OF LIGHTWAVE TECHNOLOGY, 2001, 19 (02) : 252 - 265
  • [4] A novel low-cost small-form-factor transceiver module
    Hogan, WK
    Gaio, DP
    Cohen, MS
    Trewhella, JM
    [J]. 50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 725 - 732
  • [5] Package design and measurement of 10 Gbps laser diode on high-speed silicon optical bench
    Schuster, C
    Kuchta, DM
    Colgan, EG
    Cohen, GM
    Trewhella, JM
    [J]. ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2003, : 63 - 66
  • [6] Evolution of optical subassemblies in IBM data communication transceivers
    Trewhella, JM
    Johnson, GW
    Hogan, WK
    Karst, DL
    [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 2003, 47 (2-3) : 251 - 258
  • [7] Performance comparison of small form factor fiber optic connectors
    Trewhella, JM
    DeCusatis, C
    Fox, J
    [J]. 49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, : 398 - 407