Void Formation on PCB Surface Finish During Reflow Soldering

被引：0

作者：

Ewald, Thomas D. ^{[1
,2
]}

Holle, Norbert ^{[1
]}

Wolter, Klaus-Juergen ^{[2
]}

机构：

[1] Robert Bosch GmbH, Engn Assembly & Interconnect Technol, Stuttgart, Germany

[2] Tech Univ Dresden, Elect Packaging Lab, Dresden, Germany

来源：

2011 34TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE 2011) - NEW TRENDS IN MICRO/NANOTECHNOLOGY | 2011年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Printed circuit board (PCB) surface finish and its reactive wetting process were identified as a main cause of voiding. During reflow soldering liquid flux residues adhered to the interface PCB / liquid solder alloy form voids while the solder alloy is in a liquid state. In contrast to that no voids are found when no reactive wetting occurred. Furthermore, we observed that the number of detected voids after the reflow process strongly depends on the tin layer thickness: Many voids are formed in the case of a thin tin layer, no voids are found in the case of a very thick tin layer. A model is established to explain this phenomenon.

引用

页码：153 / 161

页数：9

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