Design demonstration of band-pass-filter characteristics with integrated passive device on glass interposer

被引：0

作者：

Tanaka, Masaya ^{[1
]}

Takano, Takamasa ^{[1
]}

Okazaki, Yumi ^{[1
]}

机构：

[1] Dai Nippon Printing Co Ltd, 250-1 Wakashiba, Kashiwa, Chiba 2770871, Japan

来源：

2019 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2019) | 2019年

关键词：

Glass interposer; integrated passive device; electrical characteristiccomponent;

D O I：

10.23919/icep.2019.8733408

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We studied the fundamental characteristics of two type passive elements of the integrated passive devices (IPDs) configuration with electromagnetic field analysis and measurement. One is 3D solenoid coil using through glass via (TGV), and another is metal insulator metal (MIM) structured capacitor with inorganic dielectric thin film. Our developed 3D TGV inductor achieved high Q factor by optimizing of solenoid coil design. And our developed MIM capacitor indicates high breakdown voltage by controlling surface roughness condition of metal pad. Furthermore, we demonstrated band pass filter design that passes 2.4GHz to 2.5GHz with the combination of these IPDs. From this evaluation, our developed glass interposer (GiP) with filter function with IPDs achieved very small size, low height and better electrical characteristics compared with conventional LTCC component.

引用

页码：311 / 315

页数：5