The study of internal friction in nanocrystalline Ag and Au thin films

被引：5

作者：

Hsu, Feng-Chih ^{[1
]}

Wang, Yu-Ting ^{[1
]}

Cheng, Ya-Chi ^{[1
]}

Tong, Chi-Jia ^{[1
]}

Lin, Ming-Tzer ^{[1
]}

机构：

[1] Natl Chung Hsing Univ, Grad Inst Precis Engn, Taichung 402, Taiwan

来源：

THIN SOLID FILMS | 2014年 / 570卷

关键词：

Internal friction; Energy loss; Thickness dependence; Silver; Gold; Nanocrystalline; YOUNGS MODULUS; MICROPLASTICITY; DISSIPATION; CU;

D O I：

10.1016/j.tsf.2014.03.016

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This study investigated the internal friction in nanocrystalline silver and gold thin films (40-170 nm thick) deposited on silicon substrate. Paddle-like samples were designed to present uniform stress and all measurements were performed under high vacuum to eliminate the effects of air damping. Annealed thin films presented far less internal friction than as-deposited films. Annealing reduced the internal friction in Ag films by 3-28 times lower than those obtained from as-deposited films. Annealing reduced internal friction in Au films to 17%, 29%, and 42% in 41 nm, 90 nm, and 170 nm samples, respectively. With the exception of the thinnest Au film, the internal friction in all thin metal films was dependent on film thickness. In all cases, internal friction was affected by grain size and grain boundary. (C) 2014 Elsevier B. V. All rights reserved.

引用

页码：262 / 267

页数：6

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