Crystallographic mechanism for crack propagation in the T7451 Al-Zn-Mg-Cu alloy

被引：39

作者：

Jian, Haigen ^{[1
]}

Jiang, Feng ^{[1
]}

Wei, Lili ^{[1
]}

Zheng, Xiuyuan ^{[1
]}

Wen, Kang ^{[1
]}

机构：

[1] Cent S Univ, Sch Mat Sci & Engn, Changsha 410083, Peoples R China

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2010年 / 527卷 / 21-22期

关键词：

Al-Zn-Mg-Cu alloy; Fatigue crack; EBSD; Deflection; Misorientation; FATIGUE-CRACK; GROWTH;

D O I：

10.1016/j.msea.2010.05.063

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The electron back scattering diffraction (EBSD) technique has been applied in investigating the crystallographic mechanism of crack propagation in Al-Zn-Mg-Cu alloy. It is revealed that intergranular and transgranular crack propagation behaviours both exist and the relationship between crack propagation and orientations of adjacent grains complies with the crystal plastic deformation mechanism. When the interfacial angle between fracture surfaces of two adjacent grains is small, the crack propagates through grain boundaries with deflection of a certain angle; while small interfacial angles cannot form between slip planes in two adjacent grains, intergranular propagation occurs. (C) 2010 Elsevier B.V. All rights reserved.

引用

页码：5879 / 5882

页数：4

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