Growth Behavior of Intermetallic Compounds at SnAgCu/Ni and Cu Interfaces

被引：10
作者：
Qi, Lihua [1 ]
Huang, Jihua [1 ]
Zhang, Hua [1 ]
Zhao, Xingke [1 ]
Wang, Haitao [1 ]
Cheng, Donghai [1 ]
机构：
[1] Univ Sci & Technol Beijing, Sch Mat Sci & Engn, Beijing, Peoples R China
来源：
JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE | 2010年 / 19卷 / 01期
基金：
中国国家自然科学基金;
关键词：
Ag3Sn; growth behavior; intermetallic compound (IMC); Sn3.5Ag0.5Cu solder; thermal-shear cycling; SOLDER; MICROSTRUCTURE; ALLOYS; JOINTS; STRENGTH; COPPER; SNAG;
D O I：
10.1007/s11665-009-9423-9
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The growth behavior of reaction-formed intermetallic compounds (IMCs) at Sn3.5Ag0.5Cu/Ni and Cu interfaces under thermal-shear cycling conditions was investigated. The results show that the morphology of (Cu (x) Ni1-x )(6)Sn-5 and Cu6Sn5 IMCs formed both at Sn3.5Ag0.5Cu/Ni and Cu interfaces gradually changed from scallop-like to chunk-like, and different IMC thicknesses developed with increasing thermal-shear cycling time. Furthermore, Cu6Sn5 IMC growth rate at the Sn3.5Ag0.5Cu/Cu interface was higher than that of (Cu (x) Ni1-x )(6)Sn-5 IMC under thermal-shear cycling. Compared to isothermal aging, thermal-shear cycling led to only one Cu6Sn5 layer at the interface between SnAgCu solder and Cu substrate after 720 cycles. Moreover, Ag3Sn IMC was dispersed uniformly in the solder after reflow. The planar Ag3Sn formed near the interface changed remarkably and merged together to large platelets with increasing cycles. The mechanism of formation of Cu6Sn5, (Cu (x) Ni1-x )(6)Sn-5 and Ag3Sn IMCs during thermal-shear cycling process was investigated.
引用
收藏
页码：129 / 134
页数：6
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