Tin whisker formation on a lead-free solder alloy studied by transmission electron microscopy

被引：0
作者：
Sosiati, H. [1 ]
Kuwano, N. [2 ]
Hata, S.
Iwane, Y. [3 ,4 ]
Morizono, Y. [4 ]
Ohno, Y. [4 ]
机构：
[1] Kyushu Univ, HVEM, Kasuga, Fukuoka 8168580, Japan
[2] Kyushu Univ, ASTEC, Kasuga, Fukuoka 8168580, Japan
[3] Kyushu Univ, ASEM, Kasuga, Fukuoka 8168580, Japan
[4] Kumamoto Univ, Dept Mater Sci Engn, Kumamoto 8608555, Japan
来源：
EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2 | 2006年
关键词：
tin whisker; lead-free alloy; microstructure; TEM;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Tin whiskers grown on a Sn/Cu-plated Polyimide (PI)flexible substrate are a serious problem in electronic industrial application, because the whiskers lead to catastrophic electrical short circuit failures. Here, we report characterization of microstructures in the whiskers grown on a surface of Sn/Cu-plated PI-flexible substrate by cross-sectional transmission electron microscopy (TEM) to analyze the behavior and the formation mechanism of whiskers. The whisker was found to be monocrystalline beta-Sn and grown with the preferred directions of [110] and [101]. The whiskers formed on this tin surface are nucleated and grown by the compressive stress, that is induced externally by insertion of Sn/Cu-plated PI-flexible substrate into the connector.
引用
收藏
页码：398 / 403
页数：6
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