Thermal design of ceramic packages for high power light-emitting diodes

被引：20
|
作者：
Yang, Lianqiao [1 ]
Hu, Jianzheng [1 ]
Jang, Sunho [1 ]
Shin, Moo Whan [1 ]
机构：
[1] Myong Ji Univ, Dept Mat Sci & Engn, Yongin 449728, Kyunggi, South Korea
来源：
SEMICONDUCTOR SCIENCE AND TECHNOLOGY | 2007年 / 22卷 / 07期
关键词：
D O I：
10.1088/0268-1242/22/7/005
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Ceramic packages with different paths of thermal dissipation were designed by a simulation using the finite-volume method. Thermal resistances of the packages were obtained from the calculation of temperatures of LED ( light emitting diode) chips. It was shown that the thermal characteristics of LED packages were strongly affected by the contact area of a thermal via in contact with a LED chip rather than that in contact with a ceramic mould. Ceramic LED packages were fabricated and characterized. A deviation of simulated results from experimental results was found. The difference was attributed to the poor contact roughness between the LED chip and the thermal via.
引用
收藏
页码：705 / 708
页数：4
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