Reliability Testing of Lead-Free Solder Joints

被引：0

作者：

Bazu, Marius ^{[1
]}

Ilian, Virgil Emil ^{[1
]}

Galateanu, Lucian ^{[1
]}

Varsescu, Dragos ^{[1
]}

Pietrikova, Alena ^{[2
]}

机构：

[1] IMT Bucharest, Reliabil Lab, Natl Inst R&D Microtechnol, Bucharest, Romania

[2] Tech Univ Kosice, Fac Elect Engn & Informat, Kosice, Slovakia

来源：

2012 35TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE 2012): POWER ELECTRONICS | 2012年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

For studying the reliability of lead-free SnAgCu solder joints, reliability test were performed on test structures obtained by three variants of PCB surface finishing: Copper, Gold and HASL (Hot Air Solder Levelling), respectively, achieved by an industrial process and, in parallel, by in laboratory (research) conditions. Two types of reliability tests were used: (i) Thermal cycling at 550 degrees C / + 125 degrees C / 30 minutes at each step; (ii) Cycling damp heat at -40 degrees C / 85 degrees C and 85% RH. The results clearly show that both the industrial process and the research conditions ensure the higher reliability level for the HASL variant.

引用

页码：173 / 177

页数：5

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