Composition-Dependent Curing Behavior and Peel Strength of Epoxy Resins for Printed Circuit Boards (PCBs)

被引:8
作者
Cho, Jae-Choon [1 ]
Lee, Hwa-Young [2 ]
Lim, Sung-Taek [2 ]
Park, Moon-Soo [2 ]
Oh, Yong-Soo [2 ]
Cho, Mi-Suk [1 ]
Lee, Young-kwan [1 ]
机构
[1] Sungkyunkwan Univ, Dept Chem Engn, Suwon 440746, South Korea
[2] Samsung Electromech Co Ltd, eMD Ctr, Cent R&D Inst, Hwasung City, Gyunggi Do, South Korea
关键词
epoxy resin; PCB; curing; peel strength; surface roughness; FILM-CASTING PROCESS; FLOW-INDUCED CRYSTALLIZATION; POWDER COATINGS; POLYPROPYLENE; RHEOLOGY;
D O I
10.1007/s13233-009-0095-y
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
Insulating films for hand-held phone printed circuit boards (HHP PCBs) were manufactured from a variety of epoxy resin formulations. The epoxy resin formulations were prepared by varying the curing accelerator content. The curing behavior was investigated by viscosity measurements under isothermal conditions using a rheometer. The films were used in a general PCB manufacturing process and their adhesiveness to the electroplating layer was confirmed by peel strength tests. Their surface morphology after desmearing was examined by SEM. The peel strength of the epoxy films with a copper layer was directly dependent on their surface roughness.
引用
收藏
页码:47 / 52
页数:6
相关论文
共 21 条
[1]  
Alger M., 2017, Polymer Science Dictionary, V3
[2]  
BIELEMAN J, 1998, LACKADDITIVE, P171
[3]  
DELANGE PG, 1984, J COATING TECHNOL, V56, P23
[4]  
GABRIEL S, 1975, J OIL COAT CHEM ASS, V58, P52
[5]   Surface tension studies of additives in acrylic resin-based powder coatings using the Wilhelmy balance technique [J].
Grundke, K ;
Michel, S ;
Osterhold, M .
PROGRESS IN ORGANIC COATINGS, 2000, 39 (2-4) :101-106
[6]  
HOLDEN H, 1997, CIRCUIT WORLD, V23
[7]   Analysis of film casting process: The heat transfer phenomena [J].
Lamberti, G ;
Titomanlio, G .
CHEMICAL ENGINEERING AND PROCESSING-PROCESS INTENSIFICATION, 2005, 44 (10) :1117-1122
[8]   Real-time orientation and crystallinity measurements during the isotactic polypropylene film-casting process [J].
Lamberti, G ;
Brucato, V .
JOURNAL OF POLYMER SCIENCE PART B-POLYMER PHYSICS, 2003, 41 (09) :998-1008
[9]  
Lamberti G, 2002, MACROMOL SYMP, V185, P167, DOI 10.1002/1521-3900(200208)185:1<167::AID-MASY167>3.0.CO
[10]  
2-8