Moisture absorption mechanism in epoxy molding compounds used in IC encapsulation

被引：0
|
作者：
Premkumar, Jeromerajan [1 ]
Srikanth, Narasimalu [1 ]
机构：
[1] ASM Technol Singapore, 2 Yishun Ave 7, Singapore 768924, Singapore
来源：
EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2 | 2006年
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
hi this article the effects of moisture absorption on a novel epoxy molding compounds are quantitatively identified, based on the changes of its corresponding weight before and after moisture absorption. The experimental results reveals that the absorbed moisture (water) acts predominantly as a crazing agent, continuously increasing the weight of the epoxy by applying more pressure of the moistures related with temperature. The possible water adsorption places on the epoxy molding compounds are suggested.
引用
收藏
页码：60 / 62
页数：3
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