Relationship between hardness and grain size in electrodeposited copper films

被引:106
作者
Hakamada, Masataka [1 ]
Nakamoto, Yoshiaki
Matsumoto, Hiroshi
Iwasaki, Hajime
Chen, Youqing
Kusuda, Hiromu
Mabuchi, Mamoru
机构
[1] Kyoto Univ, Grad Sch Energy Sci, Sakyo Ku, Kyoto 6068501, Japan
[2] High Proc Res Ltd Co, Kamigori, Hyogo 6781226, Japan
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2007年 / 457卷 / 1-2期
关键词
electrodeposition; Hall-Petch relationship; Cu films; nanocrystalline Cu; hydrogen;
D O I
10.1016/j.msea.2006.12.101
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Copper films were electrodeposited under various conditions and the relationship between the hardness and grain size of the films was investigated. The Vickers hardness depended on the processing conditions. This is because the processing conditions affected the grain size. In particular, nanocrystalline Cu film with a grain size of 31 nm was obtained by optimizing the electrodeposition conditions. The hardness of the nanocrystalline film deviated from the Hall-Petch relationship because the grain size dependence of hardness is smaller for the grain sizes of < 100 nm than those of > 100 nm. Also, the constants Hv(0) and k(Hv) in the Hall-Petch relationship for films processed with thiourea were different from those for films processed with gelatin. The differences may not be related to texture but to superabundant vacancies generated in the process of electrodeposition. (c) 2007 Elsevier B.V. All rights reserved.
引用
收藏
页码:120 / 126
页数:7
相关论文
共 38 条
[1]   Age softening phenomenon of electrodeposited copper plating film [J].
Abe, H ;
Kondo, A ;
Watanabe, T .
JOURNAL OF THE JAPAN INSTITUTE OF METALS, 2004, 68 (09) :844-850
[2]   Effect of thiourea on copper dissolution and deposition [J].
Alodan, M ;
Smyrl, W .
ELECTROCHIMICA ACTA, 1998, 44 (2-3) :299-309
[3]   PLASTIC DEFORMATION OF POLYCRYSTALLINE AGGREGATES [J].
ARMSTRONG, R ;
DOUTHWAITE, RM ;
CODD, I ;
PETCH, NJ .
PHILOSOPHICAL MAGAZINE, 1962, 7 (73) :45-&
[4]   Hydrogen incorporation and embrittlement of electroformed Au, Cu and Au-Cu [J].
Bozzini, B ;
Giovannelli, G ;
Natali, S ;
Brevaglieri, B ;
Cavallotti, PL ;
Signorelli, G .
ENGINEERING FAILURE ANALYSIS, 1999, 6 (02) :83-92
[5]   Strength and tension/compression asymmetry in nanostructured and ultrafine-grain metals [J].
Cheng, S ;
Spencer, JA ;
Milligan, WW .
ACTA MATERIALIA, 2003, 51 (15) :4505-4518
[6]   ON THE VALIDITY OF THE HALL-PETCH RELATIONSHIP IN NANOCRYSTALLINE MATERIALS [J].
CHOKSHI, AH ;
ROSEN, A ;
KARCH, J ;
GLEITER, H .
SCRIPTA METALLURGICA, 1989, 23 (10) :1679-1683
[7]   The synthesis of Fe-Ni nanocrystalline alloys from additive-free electrolytes [J].
Czerwinski, F .
NANOSTRUCTURED MATERIALS, 1998, 10 (08) :1363-1369
[8]   Electrodeposition of copper from sulfate electrolytes - Effects of thiourea on resistivity and electrodeposition mechanism of copper [J].
Donepudi, VS ;
Venkatachalapathy, R ;
Ozemoyah, PO ;
Johnson, CS ;
Prakash, J .
ELECTROCHEMICAL AND SOLID STATE LETTERS, 2001, 4 (02) :C13-C16
[9]   Deformation and fracture of electrodeposited copper [J].
Ebrahimi, F ;
Zhai, Q ;
Kong, D .
SCRIPTA MATERIALIA, 1998, 39 (03) :315-321
[10]   Microstructural evolution in pulse plated nickel electrodeposits [J].
ElSherik, AM ;
Erb, U ;
Page, J .
SURFACE & COATINGS TECHNOLOGY, 1997, 88 (1-3) :70-78