Fabrication of joint Bi-2223/Ag superconducting tapes with BSCCO superconducting powders by diffusion bonding

被引：11

作者：

Wei Guo ^{[1
,2
,3
]}

Zou Guisheng ^{[2
,3
]}

Wu Aiping ^{[2
,3
]}

Zhou Fangbing ^{[2
,3
]}

Ren Jialie ^{[2
,3
]}

机构：

[1] Beihang Univ, Sch Mech Engn & Automat, Beijing 100191, Peoples R China

[2] Tsinghua Univ, Dept Mech Engn, Beijing 100084, Peoples R China

[3] Minist Educ PR China, Key Lab Adv Mfg Mat Proc Technol, Beijing 100084, Peoples R China

来源：

PHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS | 2010年 / 470卷 / 9-10期

基金：

中国国家自然科学基金; 中国博士后科学基金;

关键词：

BSCCO tapes; Diffusion bonding; Critical current; Superconducting powder; CABLE; PB;

D O I：

10.1016/j.physc.2010.03.007

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

61-Filaments Bi-2223/Ag superconducting tapes have been successfully joined with BSCCO superconducting powder interlayer by diffusion bonding. The electrical properties of the diffusion bonding joints were tested by standard four probe method and the microstructures of the joints were also examined by SEM. Additionally, the phase constituents of the superconducting powders between the tapes before and after bonding process were evaluated by XRD analysis. The result shows that the diffusion bonding joints are superconductive. The microstructures of the joint display a good bonding with no cracks and discontinuities. The joining zones are mainly composed of Bi-2223 phase, Bi-2212 phase and a small amount of CuO, Ca2PbO4. At last, the phase transformations of the superconducting powders in the bonding process are discussed. (C) 2010 Elsevier B.V. All rights reserved.

引用

页码：440 / 443

页数：4

共 17 条

[1] Microstructure and fracture properties of reaction-assisted diffusion bonding of TiAl intermetallic with Al/Ni multilayer foils [J].

Cao, J. ;

Feng, J. C. ;

Li, Z. R. .

JOURNAL OF ALLOYS AND COMPOUNDS, 2008, 466 (1-2) :363-367

[2] EFFECTS OF PB IN THE 1ST STAGES OF THE BI(2223) PHASE-FORMATION [J].

GRIVEL, JC ;

JEREMIE, A ;

HENSEL, B ;

FLUKIGER, R .

SUPERCONDUCTOR SCIENCE & TECHNOLOGY, 1993, 6 (10) :725-729

[3] BI, PB-SR-CU-O SYSTEM INCLUDING A MODULATION-FREE SUPERCONDUCTOR [J].

IKEDA, Y ;

HIROI, Z ;

ITO, H ;

SHIMOMURA, S ;

TAKANO, M ;

BANDO, Y .

PHYSICA C, 1990, 165 (02) :189-198

[4] BI,PB(2212) AND BI(2223) FORMATION IN THE BI-PB-SR-CA-CU-O SYSTEM [J].

JEREMIE, A ;

ALAMIYADRI, K ;

GRIVEL, JC ;

FLUKIGER, R .

SUPERCONDUCTOR SCIENCE & TECHNOLOGY, 1993, 6 (10) :730-735

[5] Design of superconducting band-pass sigma-delta modulators [J].

Kato, S ;

Hashimoto, T ;

Hasegawa, H ;

Hirano, S ;

Nagasawa, S ;

Miyahara, K ;

Enomoto, Y .

PHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS, 2002, 378 (PART 2) :1486-1490

[6] The grain alignment of Bi2223, Bi2212 and Bi2223+Bi2212 phases in mechanical deformation and annealing processes [J].

Li, S ;

Hu, QY ;

Liu, HK ;

Dou, SX ;

Gao, W .

PHYSICA C, 1997, 279 (3-4) :265-276

[7] Interface structure and formation mechanism of diffusion-bonded joints of SiC ceramic to TiAl-based alloy [J].

Liu, HJ ;

Feng, JC ;

Qian, YY .

SCRIPTA MATERIALIA, 2000, 43 (01) :49-53

[8] HTS Wire: status and prospects [J].

Malozemoff, AP ;

Verebelyi, DT ;

Fleshler, S ;

Aized, D ;

Yu, D .

PHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS, 2003, 386 :424-430

[9] Verification tests of a 66 kV HTSC cable system for practical use (first cooling tests) [J].

Masuda, T ;

Kato, T ;

Yumura, H ;

Watanabe, M ;

Ashibe, Y ;

Ohkura, K ;

Suzawa, C ;

Hirose, M ;

Isojima, S ;

Matsuo, K ;

Honjo, S ;

Mimura, T ;

Kuramochi, T ;

Takahashi, Y ;

Suzuki, H ;

Okamoto, T .

PHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS, 2002, 378 (PART 2) :1174-1180

[10] Development of Bi-2223HTS tape and its application to coil and current leads [J].

Oh, SS ;

Ha, HS ;

Ha, DW ;

Jang, HM ;

Park, C ;

Song, KJ ;

Kwon, YK ;

Ryu, KS .

CRYOGENICS, 2002, 42 (6-7) :377-382

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