AlInN for Vertical Power Electronic Devices

被引:11
|
作者
Peart, Matthew R. [1 ,2 ]
Tansu, Nelson [1 ,2 ]
Wierer, Jonathan J., Jr. [1 ,2 ]
机构
[1] Lehigh Univ, Dept Elect & Comp Engn, Bethlehem, PA 18015 USA
[2] Lehigh Univ, Ctr Photon & Nanoelect, Bethlehem, PA 18015 USA
关键词
AlInN; GaN; power electronic devices; power figure of merit (FOM); vertical power diodes; GAN; DIODES; TERMINATION; DESIGN; LAYERS;
D O I
10.1109/TED.2018.2866980
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The known benefits and challenges of AlInN as a next-generation power electronic semiconductor are presented. AlxIn1-xN is lattice matched to GaN at x = 0.82 and has the advantages of an available substrate, a wide bandgap (similar to 4.4 eV), and high mobility (similar to 450 cm(2)/V . s). The power figure of merit (FOM), determined using empirical and theoretical values of mobility and estimated critical electric fields determined from reported bandgaps, spans from similar to 20% to 130% times greater than GaN. In order to realize and precisely determine these high AlInN FOM values, experimental challenges will need to be overcome such as polarization-induced electric fields and bandgap discontinuities at AlInN/GaN interfaces, and controlling carrier concentration levels.
引用
收藏
页码:4276 / 4281
页数:6
相关论文
共 50 条
  • [31] Precise Current Sensor for Power Electronic Devices
    Richter, F.
    Sourkounis, C.
    2008 IEEE POWER ELECTRONICS SPECIALISTS CONFERENCE, VOLS 1-10, 2008, : 4786 - 4789
  • [32] Power supplies for cardiovascular implantable electronic devices
    Deng, Jue
    Sun, Xuemei
    Peng, Huisheng
    ECOMAT, 2023, 5 (06)
  • [33] Control of interfacial properties in power electronic devices
    Maeda, Masakatsu
    Takahashi, Yasuo
    INTERNATIONAL JOURNAL OF NANOTECHNOLOGY, 2013, 10 (1-2) : 89 - 99
  • [34] Digital Control Techniques for Power Electronic Devices
    Krishna, V. S. Rakesh
    Poddar, Abhishek
    ICACCS 2015 PROCEEDINGS OF THE 2ND INTERNATIONAL CONFERENCE ON ADVANCED COMPUTING & COMMUNICATION SYSTEMS, 2015,
  • [35] Smart clothing could power electronic devices
    Harris, Stephen
    Engineer, 2010, 6-SEPTEMBE
  • [36] SiC and GaN from the Viewpoint of Vertical Power Devices
    Suda, Jun
    2016 74TH ANNUAL DEVICE RESEARCH CONFERENCE (DRC), 2016,
  • [37] Thermal characterization of vertical GaN based power devices
    Fischer, Sandra
    Mayer, Florian
    Leitgeb, Verena
    Mitterhuber, Lisa
    Kraker, Elke
    2024 30TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS, THERMINIC 2024, 2024,
  • [38] Semiconductor devices and their use in power electronic applications
    Shammas, N. Y. A.
    Eio, S.
    Chamund, D.
    CHALLENGES IN POWER, HIGH VOLTAGES AND MACHINES: PROCEEDINGS OF THE 7TH WSEAS INTERNATIONAL CONFERENCE ON ELECTRIC POWER SYSTEMS, HIGH VOLTAGES, ELECTRIC MACHINES (POWER '07), 2007, : 258 - +
  • [39] ESD transient model of vertical DMOS power devices
    State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China
    不详
    Pan Tao Ti Hsueh Pao, 2008, 10 (2014-2017): : 2014 - 2017
  • [40] Gallium nitride devices for power electronic applications
    Baliga, B. Jayant
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2013, 28 (07)