AlInN for Vertical Power Electronic Devices

被引:11
|
作者
Peart, Matthew R. [1 ,2 ]
Tansu, Nelson [1 ,2 ]
Wierer, Jonathan J., Jr. [1 ,2 ]
机构
[1] Lehigh Univ, Dept Elect & Comp Engn, Bethlehem, PA 18015 USA
[2] Lehigh Univ, Ctr Photon & Nanoelect, Bethlehem, PA 18015 USA
关键词
AlInN; GaN; power electronic devices; power figure of merit (FOM); vertical power diodes; GAN; DIODES; TERMINATION; DESIGN; LAYERS;
D O I
10.1109/TED.2018.2866980
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The known benefits and challenges of AlInN as a next-generation power electronic semiconductor are presented. AlxIn1-xN is lattice matched to GaN at x = 0.82 and has the advantages of an available substrate, a wide bandgap (similar to 4.4 eV), and high mobility (similar to 450 cm(2)/V . s). The power figure of merit (FOM), determined using empirical and theoretical values of mobility and estimated critical electric fields determined from reported bandgaps, spans from similar to 20% to 130% times greater than GaN. In order to realize and precisely determine these high AlInN FOM values, experimental challenges will need to be overcome such as polarization-induced electric fields and bandgap discontinuities at AlInN/GaN interfaces, and controlling carrier concentration levels.
引用
收藏
页码:4276 / 4281
页数:6
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