Creep rupture of Sn-Ag-CuPb-free solder alloy

被引：0
|
作者：
Zhang, L. [1 ]
Wang, Z. G. [1 ]
Shang, J. K. [2 ]
机构：
[1] Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
[2] Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61800 USA
来源：
MECHANICAL BEHAVIOR OF MATERIALS X, PTS 1AND 2 | 2007年 / 345-346卷
基金：
中国国家自然科学基金;
关键词：
creep rupture; Pb-free alloy; Sn3.8Ag0.7Cu; parametric methods;
D O I：
10.4028/www.scientific.net/KEM.345-346.585
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The eutectic Sn3.8Ag0.7Cu alloy is widely considered a leading Pb-free replacement for the eutectic Pb-Sn solder alloy in electronic packaging where creep deformation and rupture is a major concern. In this study, creep rupture behavior of Sn-Ag-Cu solder alloy was investigated under the isothermal condition. Creep tests were conducted under a range of stresses and temperatures. Creep lifetime data were analyzed by the combined time-temperature equations following the Sherby, Larsen-Miller, and Manson-Haferd approaches. From these analyses, a series of material parameters were obtained from the experimental data. The results showed that the Manson-Hanferd method provided a better correlation with the creep rupture data. The mechanisms of creep deformation and rupture at different time-temperature combinations are discussed.
引用
收藏
页码：585 / +
页数：2
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