Bonding characteristics during very high power ultrasonic additive manufacturing of copper

被引：104

作者：

Sriraman, M. R. ^{[1
]}

Babu, S. S. ^{[1
]}

Short, M. ^{[2
]}

机构：

[1] Ohio State Univ, Welding Engn Program, Columbus, OH 43221 USA

[2] Edison Welding Inst, Columbus, OH 43221 USA

来源：

SCRIPTA MATERIALIA | 2010年 / 62卷 / 08期

关键词：

Ultrasonic additive manufacturing; Welding; Electron backscattering diffraction; Copper; Dynamic recrystallization; DYNAMIC RECRYSTALLIZATION; CONSOLIDATION; ALUMINUM; ENERGY;

D O I：

10.1016/j.scriptamat.2009.12.040

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Welding of copper foils (150 mu m thick) achieved at room temperature by very high power ultrasonic additive manufacturing was seen to involve appreciable softening and enhanced plastic flow. The initial coarse-grained structure (25 mu m) in the material changed into fine dynamically recrystallized grains (0.3-10 mu m) at the foil interface within the order of a few milliseconds of processing. This phenomenon led to metallurgical bonding through grain boundary migration and allowed for successive welding of tapes to form a three-dimensional part. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：560 / 563

页数：4

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