An improved high-power X-band 4x4 tile-type LTCC T/R module based on liquid cooling micro-channels

被引：0

作者：

Wang, Zhigang ^{[1
]}

Xiao, Jinghan ^{[1
]}

Huang, Junyi ^{[1
]}

Yin, Hua ^{[1
]}

Yang, Yulin ^{[1
]}

Yan, Bo ^{[1
]}

Zhao, Botao ^{[2
]}

机构：

[1] Univ Elect Sci & Technol China, Fundamental Sci EHF Lab, Chengdu, Sichuan, Peoples R China

[2] 54th Insitute CETC, Beijing, Peoples R China

来源：

2019 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS) | 2019年

关键词：

T/R module; liquid cooling; Low Temperature Co-fired Ceramics (LTCC); tile-type; power density;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The tile-type architecture based on low temperature co-fired ceramic (LTCC) is a useful approach to realize miniaturization of multichannel transmit-receive modules (T/R modules). However, it is a challenge to dissipate high heat for a high-power multichannel T/R module. In this paper, an improved 4x4 tile-type T/R module is proposed. The liquid cooling micro-channels structure integrated in LTCC substrate is designed and optimized to solve the problem of dissipating high-power heat. The prototype module exhibits 35 dBm of transmitting power in each channel with chip temperature below 50 degrees C at X-band, and the heat dissipation power density of the module at least reaches 3.3 W/cm(2). Measurements show a receiving gain of 16 dB in each channel, a noise figure of 4 dB, a maximum attenuation error of 1.25 dB and a maximum phase shift error of 5.463 degrees.

引用

页码：1042 / 1045

页数：4

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