Special issue on design, test, integration and packaging of MEMS/MOEMS: DTIP, Cannes, 2014

被引：0

作者：

Megherbi, Souhil ^{[1
]}

Michel, Bernd ^{[2
]}

机构：

[1] Univ Paris 11, Inst Elect Fondamentale, Bat 220, F-91405 Orsay, France

[2] Microsyst Technol, Micro Mat Ctr, Berlin, Germany

来源：

MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS | 2016年 / 22卷 / 03期

关键词：

D O I：

10.1007/s00542-015-2712-3

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：449 / 449

页数：1

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