Impact of nonlinearities on electronic device transient thermal responses

被引：35

作者：

Janicki, Marcin ^{[1
]}

Sarkany, Zoltan ^{[2
]}

Napieralski, Andrzej ^{[1
]}

机构：

[1] Lodz Univ Technol, Dept Microelect & Comp Sci, Lodz, Poland

[2] Mentor Graph Corp, Mech Anal Div, Budapest, Hungary

来源：

MICROELECTRONICS JOURNAL | 2014年 / 45卷 / 12期

关键词：

Compact thermal models; Nonlinear effects; Heat transfer; HEAT-FLOW PATH; GENERATION; MODELS;

D O I：

10.1016/j.mejo.2014.04.043

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper investigates the influence of nonlinearilies on electronic device thermal transient responses. The discussions in the paper are based on practical examples where thermal responses or a power device are recorded in various boundary conditions for different values or dissipated power. Then, the measurement results are analysed using the Network Identification by a Deconvolution method and the differences between particular cases are discussed in detail. The presented experimental results demonstrate that the nonlinearities due to the temperature dependence or thermal model parameters might have important influence on the results, especially when still an cooling is applied. In addition, in selected cases the simulations results obtained with compact thermal models were compared with measurements. (C) 2014 Elsevier Ltd. All rights reserved.

引用

页码：1721 / 1725

页数：5

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