Ablation of Copper by a Single Ultrashort Laser Pulse

被引：11

作者：

Wang, S. Y. ^{[1
]}

Ren, Y. P. ^{[2
]}

Chang, K. P. ^{[1
]}

Cheng, C. W. ^{[3
]}

Chen, J. K. ^{[2
]}

Tzou, D. Y. ^{[2
]}

机构：

[1] Ind Technol Res Inst, Tainan 734, Taiwan

[2] Univ Missouri, Dept Mech & Aerosp Engn, Columbia, MO 65211 USA

[3] Natl Chiao Tung Univ, Dept Mech Engn, Hsinchu 30010, Taiwan

来源：

JOURNAL OF LASER MICRO NANOENGINEERING | 2014年 / 9卷 / 02期

关键词：

femtosecond laser; axisymmetric model; thermal ablation; copper film; TARGETS; METALS;

D O I：

10.2961/jlmn.2014.02.0002

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Thermal ablation of copper films by a single Ti:Sapphire femtosecond laser pulse of wavelength 800 nm and duration 100 fs was investigated experimentally and theoretically. The laser experiments were performed; the ablation depth and crater profiles were measured for laser fluences up to 1037 J/cm(2). A comprehensive axisymmetric model, including a two-temperature model, phase change models for rapid melting and evaporation, and a phase explosion model for ejecting metastable liquid and vapor, was developed to simulate the laser material ablation process. The simulated ablation depths and crater profiles agree well with the experimental measurements.

引用

页码：88 / 92

页数：5

共 27 条

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