Distinct modes in the evolution of interaction between polymer film and atmospheric pressure plasma jet

被引：7

作者：

Wang, Tao ^{[1
]}

Yang, Bin ^{[1
]}

Chen, Xiang ^{[1
]}

Wang, Xiaolin ^{[1
]}

Yang, Chunsheng ^{[1
]}

Liu, Jingquan ^{[1
]}

机构：

[1] Shanghai Jiao Tong Univ, Natl Key Lab Sci & Technol Micro Nano Fabricat, Key Lab Thin Film & Micro Fabricat,Minist Educ, Collaborat Innovat Ctr IFSA,Dept Micro Nanoelect, Shanghai 200240, Peoples R China

来源：

PLASMA PROCESSES AND POLYMERS | 2017年 / 14卷 / 07期

基金：

中国国家自然科学基金;

关键词：

floating substrate; interaction mode; plasma jet; polymer treatments; SURFACE;

D O I：

10.1002/ppap.201600067

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Different modes are revealed and characterized in the evolution of interaction between an atmospheric pressure He/O-2 plasma jet and the parylene-C film deposited on a silicon substrate. In the initial mode, the plasma jet spreads on the film surface with the etching process layer by layer from the top to the bottom of the polymer film. Transition mode occurs with sudden change of discharge and plasma characteristics . Then coupled mode dominated the interaction process with the plasma confined in the etched hole and advanced lap by lap from inner to outer domain in the radial direction. To copper substrate, the same distinct modes were also observed. However, to the glass substrate, only layer by layer etching process was observed.

引用

收藏

页数：9

相关论文

共 29 条

[1] Developments of plasma etching technology for fabricating semiconductor devices [J].

Abe, Haruhiko ;

Yoneda, Masahiro ;

Fujlwara, Nobuo .

JAPANESE JOURNAL OF APPLIED PHYSICS, 2008, 47 (03) :1435-1455

[2] Reactivity zones around an atmospheric pressure plasma jet [J].

Birer, Ozgur .

APPLIED SURFACE SCIENCE, 2015, 354 :420-428

[3] Dielectric barrier discharge for surface treatment: application to selected polymers in film and fibre form [J].

Borcia, G ;

Anderson, CA ;

Brown, NMD .

PLASMA SOURCES SCIENCE & TECHNOLOGY, 2003, 12 (03) :335-344

[4] Numerical and experimental study of the dynamics of a μs helium plasma gun discharge with various amounts of N2 admixture [J].

Bourdon, Anne ;

Darny, Thibault ;

Pechereau, Francois ;

Pouvesle, Jean-Michel ;

Viegas, Pedro ;

Iseni, Sylvain ;

Robert, Eric .

PLASMA SOURCES SCIENCE & TECHNOLOGY, 2016, 25 (03)

[5] Effects of gas pressure and substrate temperature on the etching of parylene-N using a remote microwave oxygen plasma [J].

Callahan, RRA ;

Raupp, GB ;

Beaudoin, SP .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2001, 19 (03) :725-731

[6] Microfabrication Methods for Biodegradable Polymeric Carriers for Drug Delivery System Applications: A Review [J].

Cho, Dong-Il Dan ;

Yoo, Hyung Jung .

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2015, 24 (01) :10-18

[7] Competitive and synergistic effects between excimer VUV radiation and O radicals on the etching mechanisms of polyethylene and fluoropolymer surfaces treated by an atmospheric He-O2 post-discharge [J].

Dufour, T. ;

Hubert, J. ;

Vandencasteele, N. ;

Viville, P. ;

Lazzaroni, R. ;

Reniers, F. .

JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2013, 46 (31)

[8] Interaction of an argon plasma jet with a silicon wafer [J].

Engelhardt, Max ;

Pothiraja, Ramasamy ;

Kartaschew, Konstantin ;

Bibinov, Nikita ;

Havenith, Martina ;

Awakowicz, Peter .

JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2016, 49 (14)

[9] High Rate Etching of Polymers by Means of an Atmospheric Pressure Plasma Jet [J].

Fricke, Katja ;

Steffen, Hartmut ;

von Woedtke, Thomas ;

Schroeder, Karsten ;

Weltmann, Klaus-Dieter .

PLASMA PROCESSES AND POLYMERS, 2011, 8 (01) :51-58

[10] Plasma jet printing for flexible substrates [J].

Gandhiraman, Ram P. ;

Singh, Eric ;

Diaz-Cartagena, Diana C. ;

Nordlund, Dennis ;

Koehne, Jessica ;

Meyyappan, M. .

APPLIED PHYSICS LETTERS, 2016, 108 (12)