Development of high aspect ratio via filling process for 3D packaging application

被引：0
|
作者：
Praveen, Sampath Kumar [1 ]
Tsan, Ho Wai [1 ]
Chua, Kenneth [1 ]
Trang Lam [1 ]
Nagarajan, Ranganathan [1 ]
机构：
[1] ASTAR, Inst Microelect, 11 Sci Pk Rd,Singapore Sci Pk 2, Singapore 117685, Singapore
来源：
2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) | 2010年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents our development work to achieve high aspect ratio void-free polymer via filling with various types of organic materials for potential application in 3D wafer level packaging. This study focuses on the development of via filling process using the conventional spin-coating and curing process. Thermoplastic polymers have been selected for this evaluation due to its ability to reflow and fill gaps easily. Test wafers with circular via patterns with diameters from 1-70 mu m with aspect ratios from 1-10 have been evaluated. The various challenges to achieving void-free via filling have been presented and it has been demonstrated that a void-free filling is feasible for vias with aspect ratio of 1-8.
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页码：762 / 764
页数：3
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