Development of a vibration device for grinding with microvibration

This study aimed to develop a device to facilitate grinding experiments with microvibration for analyzing the vibration effect on surface finish of ground surfaces. A microvibration device was designed and fabricated. It can be used to provide microvibration to the workpiece vertically and/or horizontally during grinding. The relationship of the driving voltage, vibration displacement, and frequency was established. The vibration displacement of the device developed is proportional to the driving voltage amplitude for both vibration directions. The vibration frequency and displacement can be adjusted during the grinding process. Grinding experiments were carried out to compare the surface finish of silicon samples ground with and without microvibration. The results verified that microvibration of the workpiece along a certain direction during grinding can affect the surface finish of the ground workpiece.