Effect of composition and cooling rate on the microstructure of SnAgCu-solder joints

被引：28

作者：

Mueller, M. ^{[1
]}

Wiese, S. ^{[1
]}

Roellig, M. ^{[1
]}

Wolter, K. -J. ^{[1
]}

机构：

[1] Tech Univ Dresden, IAVT, D-01062 Dresden, Germany

来源：

57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS | 2007年

关键词：

D O I：

10.1109/ECTC.2007.374006

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this study the solder alloys SnAg3.5, SnAg3.0Cu0.5, SnAg3.8Cu0.7 and SnAg2.7Cu0.4Ni0.05 have been analysed in order to determine variations in microstructure caused by cooling rate.. solder composition and ball diameter. Solder spheres with a diameter of approx. circle divide 1100 mu m, circle divide 590 mu m, circle divide 270 mu m and circle divide 130 mu m were solidified with cooling rates of 114 K/s, 1.1 K/s and 10.9 K/s. Cross sections of these specimens were analysed by optical light microscopy. Interpretations of the analysed microstructure allow a description of the solidification process, which takes place in a solder ball. It could be concluded that this process is divided in three stages: the formation of primary intermetallics, the formation of fine structured regions and the formation of coarse dendritic areas.

引用

页码：1579 / +

页数：2