Finite element analysis of PWB warpage due to the solder masking process

被引：31

作者：

Ume, IC ^{[1
]}

Martin, T ^{[1
]}

Gatro, JT ^{[1
]}

机构：

[1] ALLIED SIGNAL LAMINATE SYST, LA CROSSE, WI USA

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A | 1997年 / 20卷 / 03期

关键词：

printed wiring board; printed wiring board assembly;

D O I：

10.1109/95.623024

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Researchers have begun to examine the various manufacturing processes that a printed wiring board (PWB) undergoes during its production, such as lamination, solder masking, and soldering process to determine their impact on board warpage, The goal of this paper is to determine effects of the solder masking process on the PWB warpage,:Finite element analysis was used to study the effects of the solder masking process, in particular the curtain coating and curing processes on PWB warpage of four different board designs, These analyses have aided development of general guidelines that should be observed when selecting solder masking material.

引用

页码：295 / 306

页数：12

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