Corrosion behavior of Cu during graphene growth by CVD

被引：48

作者：

Dong, Yuhua ^{[1
]}

Liu, Qingqing ^{[1
]}

Zhou, Qiong ^{[1
]}

机构：

[1] China Univ Petr, Coll Sci, Beijing 102249, Peoples R China

来源：

CORROSION SCIENCE | 2014年 / 89卷

关键词：

Copper; EIS; SEM; COPPER; BARRIER; GRAINS;

D O I：

10.1016/j.corsci.2014.08.026

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The corrosion performance of Cu samples may be affected by annealing at high temperatures during graphene growth via the chemical vapor deposition method. In this study, multiple graphene films were deposited on Cu and characterized by Raman spectroscopy and transmission electron microscopy. The corrosion behavior of Cu immersed in 3.5 wt.% NaCl solution was investigated using electrochemical impedance spectroscopy. The Cu morphology was observed by optical microscopy and scanning electron microscopy. Results indicated that annealing affects the corrosion process of Cu. The presence of graphene films on the Cu substrate improved the corrosion performance of the material for a short period of time. (C) 2014 Elsevier Ltd. All rights reserved.

引用

页码：214 / 219

页数：6

共 16 条

[1] Oxidation Resistance of Graphene-Coated Cu and Cu/Ni Alloy [J].

Chen, Shanshan ;

Brown, Lola ;

Levendorf, Mark ;

Cai, Weiwei ;

Ju, Sang-Yong ;

Edgeworth, Jonathan ;

Li, Xuesong ;

Magnuson, Carl W. ;

Velamakanni, Aruna ;

Piner, Richard D. ;

Kang, Junyong ;

Park, Jiwoong ;

Ruoff, Rodney S. .

ACS NANO, 2011, 5 (02) :1321-1327

[2] Doping graphene with metal contacts [J].

Giovannetti, G. ;

Khomyakov, P. A. ;

Brocks, G. ;

Karpan, V. M. ;

van den Brink, J. ;

Kelly, P. J. .

PHYSICAL REVIEW LETTERS, 2008, 101 (02)

[3] Intermediate annealing of pure copper during cyclic equal channel angular pressing [J].

Han, W. Z. ;

Wu, S. D. ;

Li, S. X. ;

Wang, Y. D. .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2008, 483-84 (1-2 C) :430-432

[4] Low temperature deposited graphene by surface wave plasma CVD as effective oxidation resistive barrier [J].

Kalita, Golap ;

Ayhan, Muhammed E. ;

Sharma, Subash ;

Shinde, Sachin M. ;

Ghimire, Dilip ;

Wakita, Koichi ;

Umeno, Masayoshi ;

Tanemura, Masaki .

CORROSION SCIENCE, 2014, 78 :183-187

[5] Exploring graphene as a corrosion protection barrier [J].

Kirkland, N. T. ;

Schiller, T. ;

Medhekar, N. ;

Birbilis, N. .

CORROSION SCIENCE, 2012, 56 :1-4

[6] Graphene: An effective oxidation barrier coating for liquid and two-phase cooling systems [J].

Kousalya, Arun S. ;

Kumar, Anurag ;

Paul, Rajib ;

Zemlyanov, Dmitry ;

Fisher, Timothy S. .

CORROSION SCIENCE, 2013, 69 :5-10

[7] Effect of neighboring grains on the microscopic corrosion behavior of a grain in polycrystalline copper [J].

Lapeire, L. ;

Martinez-Lombardia, E. ;

Verbeken, K. ;

De Graeve, I. ;

Kestens, L. A. I. ;

Terryn, H. .

CORROSION SCIENCE, 2013, 67 :179-183

[8]

Lee JE, 2007, J MATER PROCESS TECH, V187, P546, DOI 10.1016/j.jmatprotec.2006.11.021

[9] Corrosion behaviour of copper under chloride-containing thin electrolyte layer [J].

Liao, Xiaoning ;

Cao, Fahe ;

Zheng, Liyun ;

Liu, Wenjuan ;

Chen, Anna ;

Zhang, Jianqing ;

Cao, Chunan .

CORROSION SCIENCE, 2011, 53 (10) :3289-3298

[10] Scanning droplet cell investigations on single grains of a FeAlCr light weight ferritic steel [J].

Lill, KA ;

Hassel, AW ;

Frommeyer, G ;

Stratmann, M .

ELECTROCHIMICA ACTA, 2005, 51 (05) :978-983

← 1 2 →