The role of proximity caps during the annealing of UV-ozone oxidized GaAs

被引:15
作者
Ghosh, S. C.
Biesinger, M. C.
LaPierre, R. R.
Kruse, P.
机构
[1] McMaster Univ, Dept Chem, Hamilton, ON L8S 4M1, Canada
[2] McMaster Univ, Ctr Emerging Devices Technol, Dept Engn Phys, Hamilton, ON L8S 4L7, Canada
[3] Univ Western Ontario, Western Sci Ctr, London, ON N6A 5B7, Canada
基金
加拿大自然科学与工程研究理事会;
关键词
D O I
10.1063/1.2740359
中图分类号
O59 [应用物理学];
学科分类号
摘要
This study provides a deeper insight into the chemistry and physics of the common engineering practice of using a proximity cap, while annealing compound semiconductors such as GaAs. We have studied the cases of a GaAs proximity cap, a Si proximity cap, and no proximity cap. Using x-ray photoelectron spectroscopy, it has been found that annealing increases the gallium to arsenic ratio in the oxide layer in all cases. During the annealing of UV-ozone oxidized GaAs, it has been observed that GaAs proximity caps also serve as a sacrificial layer to accelerate the desorption of oxide species. In all cases surface deterioration due to pit formation has been observed, and the depth of pits is found to depend on the effective role played by the capping material. Energy dispersive x-ray analysis provides additional evidence that pits mainly consist of elemental As and gallium oxide, with most of the elemental As situated at the pit-substrate interface. Deposition of a thin layer of gold and subsequent annealing to 500 degrees C for 300 s under different capping conditions shows the use of a proximate cap to be practically insignificant in annealing Au deposited films. (c) 2007 American Institute of Physics.
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页数:6
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