Programmed self-assembly of microscale components using biomolecular recognition through the avidin-biotin interaction

被引:1
|
作者
Olsen, Trevor [1 ]
Ng, Jason [1 ]
Stepanova, Maria [1 ,2 ]
Dew, Steven K. [1 ,2 ]
机构
[1] Univ Alberta, Dept Elect & Comp Engn, Edmonton, AB T6G 2V4, Canada
[2] Natl Inst Nanotechnol, Edmonton, AB T6G 2M9, Canada
来源
基金
加拿大自然科学与工程研究理事会;
关键词
FABRICATION; PARTICLES; SCALE; WATER;
D O I
10.1116/1.4893075
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Following continuing trends in nanofabrication, the near future may see the requirement to integrate and assemble devices and integrated circuits that are below the scale that conventional robotic pick-and-place systems can successfully accommodate. Presented here is a protein-ligand based approach to self-assembling micronscale components onto specific patterned locations on a substrate. Other than the benefits in scale, this integration method may be advantageous for its parallel nature, 3D capabilities, and the ability to integrate devices made from incompatible processing technologies into a single platform (heterogeneous integration). Five micrometer square silicon microtiles were fabricated as model devices for microscale integrated circuits. They were fabricated from a silicon-on-insulator substrate and released into solution by bath ultrasonication after the buried oxide layer underneath them was underetched. A silicon target substrate was also patterned with gold pads for the microtiles to assemble onto. Self-assembled monolayers were employed to functionalize both the microtiles and the gold pads with biotin and avidin, respectively. Due to the very strong protein-ligand binding between avidin and biotin, the functionalized microtiles in solution were able to attach onto the target gold pads with a high selectivity. In this demonstration, for 5 mu m square microtiles assembling onto square gold pads of the same size, 2.0% of the gold pads were covered by the microtiles and a selectivity (microtiles assembling onto the gold pads as opposed to the silicon substrate) of 7.3:1 was achieved. (C) 2014 American Vacuum Society.
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页数:8
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