Recent Progress of High Thermal Conductivity of Low Temperature Curing Electronic Paste

Electronic paste is an excellent thermal interface material (TIM), which is widely used in ultra-high speed computer chips, power semiconductor devices and LED, and it can achieve mechanical connection, electric connection and thermal connection between chip and heat sink by low temperature curing process, which can satisfy the application requirements and service conditions at high temperature. This paper reviewed the recent development of nano silver and carbon nanotubes application in low temperature curing electronic paste. Based on the influence on thermal conductivity structure of silver nanoparticles and carbon nanotubes, we separately presented: (1) the influence of the size of nano silver, surface coated agent and twins growth mode on the thermal conductivity in electronic paste; (2) the vertically aligned carbon nanotubes are prepared and the joint interface are modified and decorated, and TIM is prepared to form high thermal conduction path by connecting chip and heat sink; (3) the interface influence of silver nanoparticles decorated carbon nanotubes and the effect of silver powder to prepare three-dimensional composite thermal conductive structure by sintered bonding on enhancing the thermal conductivity of electronic paste. Finally, we expressed the expectation for nano silver and carbon nanotubes application in improving the thermal conductivity of the electronic paste in the future.