Passive and chipless packaged transducer for wireless pressure measurement

被引：4

作者：

Philippe, J. ^{[1
]}

De Paolis, M. V. ^{[1
]}

Arenas-Buendia, C. ^{[1
]}

Henry, D. ^{[1
]}

Coustou, A. ^{[1
]}

Rumeau, A. ^{[1
]}

Aubert, H. ^{[1
]}

Pons, P. ^{[1
]}

机构：

[1] Univ Toulouse, CNRS, INP, LAAS, 7 Ave Colonel Roche,BP54200, F-31031 Toulouse 4, France

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 2018年 / 279卷

关键词：

Passive sensor; Chipless sensor; Pressure sensor; INTERROGATION; SENSORS;

D O I：

10.1016/j.sna.2018.06.024

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A new microwave fully passive, chipless and packaged sensor for wireless pressure monitoring in harsh environments (such as, extreme temperature, radioactive and/or toxic environments) is proposed in this paper. The sensor consists of a planar microstrip resonator, which is electromagnetically coupled with a high resistivity and thin silicon membrane. Prototypes have been designed and fabricated using a photoresist intermediate layer for the silicon membrane bonding. The electromagnetic simulation of the system is also performed in order to predict the transducer performances. Measurement results using the packaged sensor are provided to experimentally validate the simulation results and the manufacturing process. (C) 2018 Elsevier B.V. All rights reserved.

引用

页码：753 / 762

页数：10

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