共 23 条
[21]
Stacking ensemble learning based material removal rate prediction model for CMP process of semiconductor wafer
[J].
AI EDAM-ARTIFICIAL INTELLIGENCE FOR ENGINEERING DESIGN ANALYSIS AND MANUFACTURING,
2024, 38
[22]
Development of semi empirical model on material removal rate in WEDM process for aluminium metal matrix material using dimensional analysis
[J].
International Journal of Manufacturing Research,
2019, 14 (03)
:217-230