An analytical model of the material removal rate between elastic and elastic-plastic deformation for a polishing process

被引:28
|
作者
Lin, Tsann-Rong [1 ]
机构
[1] Natl Formosa Univ, Dept Mech Mfg Engn, Huwei 632, Taiwan
关键词
material removal rate; polishing; micro-contact mechanics;
D O I
10.1007/s00170-005-0391-4
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
This paper develops an analytical model for the material removal rate during specimen polishing. The model is based on the micro-contact elastic mechanics, micro-contact elastic-plastic mechanics and abrasive wear theory. The micro-contact elastic mechanics between the pad-specimen surfaces used the Greenwood and Williamson elastic model. The micro-contact elastic-plastic mechanics between specimen and particle, as well as the micro-contact elastic mechanics between particle and pad, are also analyzed. The cross-sectional area of the worn groove in the specimen is considered as trapezoidal area. A close-form solution of material removal rate from the specimen surface is the function of average diameter of slurry particles, pressure, the specimen/pad sliding velocity, Equivalent Young's modulus, RMS roughness of the pad, and volume concentration of the slurry particle.
引用
收藏
页码:675 / 681
页数:7
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