Creep behavior and microstructural evolution of 8030 aluminum alloys compressed at intermediate temperature

被引:17
作者
Chen, Peng [1 ]
Fan, Xiangze [1 ]
Yang, Qingbo [1 ]
Zhang, Zhiqing [1 ,2 ]
Jia, Zhihong [1 ]
Liu, Qing [1 ,3 ]
机构
[1] Chongqing Univ, Coll Mat Sci & Engn, Chongqing 400045, Peoples R China
[2] China Xipeng Aluminum Ind Pk, Chongqing 401326, Peoples R China
[3] Nanjing Tech Univ, Res Ctr Lightweight & High Performance Mat, Nanjing 210009, Peoples R China
来源
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T | 2021年 / 12卷
基金
中国国家自然科学基金;
关键词
8030 aluminum alloys; Compression creep; Intermediate temperature; Microstructure; Constitutive equation; TENSILE; FE;
D O I
10.1016/j.jmrt.2021.03.052
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The compression creep behavior of 8030 aluminum alloys at intermediate temperature was studied under the deformation temperature of 200 similar to 250 degrees C and compression stress ranging from 20 to 40 MPa. The apparent stress exponent (n(a)), the true stress exponent (n(t)) and the activation energy Q(c) for creep were n(a) = 3.6, n(t) = 3 and Q(c) = 145.5 kJ/mol, respectively, indicating that the dislocation viscous glide controlled by lattice self-diffusion was the dominant creep mechanism of the samples at 200 degrees C-20 MPa. A creep constitutive equation was introduced with the threshold stress sigma(0) = 5.1 MPa. The microstructure characterization of selected samples was investigated by transmission electron microscopy (TEM), indicating that the sub-grain contours became ambiguous and the dislocations with long curved morphologies were homogeneously distributed within grain inners after creep for 100h. (C) 2021 Published by Elsevier B.V.
引用
收藏
页码:1755 / 1761
页数:7
相关论文
共 22 条
  • [1] Ashby M.F., 1982, DEFORMATION MECH MAP
  • [2] Low-temperature creep behavior and microstructural evolution of 8030 aluminum cables
    Jiang, Xinyang
    Zhang, Ying
    Yi, Danqing
    Wang, Haisheng
    Deng, Xianbo
    Wang, Bin
    [J]. MATERIALS CHARACTERIZATION, 2017, 130 : 181 - 187
  • [3] Low temperature creep plasticity
    Kassner, Michael E.
    Smith, Kamia
    [J]. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2014, 3 (03): : 280 - 288
  • [4] Kassner MX., 2004, FUNDAMENTAL CREEP ME
  • [5] Low-temperature creep behavior of ultrafine-grained 5083 Al alloy processed by equal-channel angular pressing
    Kim, Ho-Kyung
    [J]. JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, 2010, 24 (10) : 2075 - 2081
  • [6] A simple procedure for estimating threshold stresses in the creep of metal matrix composites
    Li, Y
    Langdon, TG
    [J]. SCRIPTA MATERIALIA, 1997, 36 (12) : 1457 - 1460
  • [7] Tensile and indentation creep behavior of Mg-5% Sn and Mg-5% Sn-2% Di alloys
    Liu, Hongmei
    Chen, Yungui
    Tang, Yongbai
    Wei, Shanghai
    Niu, Gao
    [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2007, 464 (1-2): : 124 - 128
  • [8] Effect of Mg addition on the creep and yield behavior of an Al-Sc alloy
    Marquis, EA
    Seidman, DN
    Dunand, DC
    [J]. ACTA MATERIALIA, 2003, 51 (16) : 4751 - 4760
  • [9] Impression creep behavior of Al-1.9%Ni-1.6%Mn-1%Mg alloy
    Miresmaeili, S. M.
    Nami, B.
    [J]. MATERIALS & DESIGN, 2014, 56 : 286 - 290
  • [10] Correlation between creep behavior in Al-based solid solution alloys and powder metallurgy Al alloys
    Mohamed, FA
    [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1998, 245 (02): : 242 - 256