Modeling board-to-board interconnections

被引：0

作者：

Gailus, M

Fusi, MA

Zanella, F

机构：

来源：

CONNECTOR SPECIFIER | 1996年 / 12卷 / 05期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：16 / 17

页数：2

共 50 条

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