Modeling board-to-board interconnections

被引：0
作者：
Gailus, M
Fusi, MA
Zanella, F
机构：
来源：
CONNECTOR SPECIFIER | 1996年 / 12卷 / 05期
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D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
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页码：16 / 17
页数：2
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