Effect of abrasive particle shape on the development of silicon substrate during nano-grinding

被引:22
作者
Huang, Yuhua [1 ]
Wang, Miaocao [1 ]
Li, Jinming [1 ]
Zhu, Fulong [1 ]
机构
[1] Huazhong Univ Sci & Technol, Inst Microsyst, Sch Mech Sci & Engn, 1037 Luoyu Rd, Wuhan 430074, Hubei, Peoples R China
基金
中国国家自然科学基金;
关键词
Particle shape; Material removal rate; Roughness; Subsurface damage; XRD; SINGLE-CRYSTAL SILICON; MOLECULAR-DYNAMICS; TOOL GEOMETRY; CUTTING BEHAVIOR; MATERIAL REMOVAL; EDGE RADIUS; SIMULATIONS; TEMPERATURE; SHARPNESS; SURFACE;
D O I
10.1016/j.commatsci.2021.110420
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The interactions between silicon substrate and abrasive particles are the important mechanical process during nano-grinding. We conducted the molecular dynamics simulations to explore the influence of the different abrasive particle shapes ?the common as-synthesized diamond shapes (cubic, cubo-octahedral, and octahedral) ?on the macro real-time observables, including grinding force, temperature, roughness, subsurface damage, material removal rate, and XRD spectra, from the atom-level insight. The results show that the different shapes might produce a different effect during the nano-grinding. According to the required demand, the different particle shapes could tend to be considered. For example, the cubo-octahedral was suitable for the rough nanogrinding; the octahedral was suitable for the finish nano-grinding. The results of this study might provide an atom-level optimal strategy.
引用
收藏
页数:9
相关论文
共 52 条
[1]   Review of molecular dynamics/experimental study of diamond-silicon behavior in nanoscale machining [J].
Abdulkadir, Lukman N. ;
Abou-El-Hossein, Khaled ;
Jumare, Abubakar I. ;
Liman, Muhammad M. ;
Olaniyan, Tirimisiyu A. ;
Odedeyi, Peter Babatunde .
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2018, 98 (1-4) :317-371
[2]   The effect of the cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon wafer [J].
Arefin, S. ;
Li, X. P. ;
Cai, M. B. ;
Rahman, M. ;
Liu, K. ;
Tay, A. .
PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE, 2007, 221 (02) :213-220
[3]   Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation [J].
Cai, M. B. ;
Li, X. P. ;
Rahman, A. .
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2007, 192 (607-612) :607-612
[4]   Crack initiation in relation to the tool edge radius and cutting conditions in nanoscale cutting of silicon [J].
Cai, M. B. ;
Li, X. P. ;
Rahman, M. ;
Tay, A. A. O. .
INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2007, 47 (3-4) :562-569
[5]   Virtual diffraction analysis of Ni [010] symmetric tilt grain boundaries [J].
Coleman, S. P. ;
Spearot, D. E. ;
Capolungo, L. .
MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING, 2013, 21 (05)
[6]   Evolution of nano-cracks in single-crystal silicon during ultraprecision mechanical polishing [J].
Dai, Houfu ;
Zhou, Yuqi ;
Li, Ping ;
Zhang, Yunfei .
JOURNAL OF MANUFACTURING PROCESSES, 2020, 58 :627-636
[7]   Atomistic simulation of influence of laser nano-structured diamond abrasive on the polishing behavior of silicon [J].
Dai, Houfu ;
Zhou, Yuqi ;
Zhang, Fa .
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2020, 105
[8]   Investigation of tool geometry in nanoscale cutting single-crystal copper by molecular dynamics simulation [J].
Dai, Houfu ;
Du, Hao ;
Chen, Jianbin ;
Chen, Genyu .
PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART J-JOURNAL OF ENGINEERING TRIBOLOGY, 2019, 233 (08) :1208-1220
[9]   Influence of laser nanostructured diamond tools on the cutting behavior of silicon by molecular dynamics simulation [J].
Dai, Houfu ;
Chen, Genyu ;
Li, Shaobo ;
Fang, Qihong ;
Hu, Bang .
RSC ADVANCES, 2017, 7 (25) :15596-15612
[10]   Diamond particle shape: Its measurement and influence in abrasive wear [J].
De Pellegrin, Dennis V. ;
Corbin, Normand D. ;
Baldoni, Gary ;
Torrance, Andrew A. .
TRIBOLOGY INTERNATIONAL, 2009, 42 (01) :160-168