Thermal vs energy optimization for DVFS-enabled processors in embedded systems

被引:0
作者
Liu, Yongpan [1 ]
Yang, Huazhong [1 ]
Dick, Robert P. [2 ]
Wang, Hui [1 ]
Shang, Li [3 ]
机构
[1] Tsinghua Univ, Dept Elect Engn, Beijing, Peoples R China
[2] Northwestern Univ, Dept Elect Engn & Comp Sci, Evanston, IL 60208 USA
[3] Queens Univ, Kingston, ON K7L 3N6, Canada
来源
ISQED 2007: PROCEEDINGS OF THE EIGHTH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN | 2007年
基金
加拿大自然科学与工程研究理事会; 美国国家科学基金会;
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In the past, dynamic voltage and frequency scaling (DVFS) has been widely used for power and energy optimization in embedded system design. As thermal issues become increasingly prominent, we propose design-time thermal optimization techniques for embedded systems. By carefully planning DVFS at design time, our techniques proactively optimize system thermal profile, prevent run-time thermal emergencies, minimize cooling costs, and optimize system performance. To the best of our knowledge, this is the first work addressing embedded system design-time thermal optimization using DVFS. We formulate minimization of application peak temperature in the presence of real-time constraints as a nonlinear programming problem. This provides a powerful framework for system designers to determine a proper thermal solution and provide a lower bound on the minimum temperature achievable by DVFS. Furthermore, we examine the differences between optimal energy solutions and optimal peak temperature solutions. Experimental results indicate that optimizing energy consumption can lead to unnecessarily high temperature. Finally, we propose a thermal-constrained energy optimization procedure to minimize system energy consumption under a constraint on peak temperature.
引用
收藏
页码:204 / +
页数:2
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