LC temperature-pressure sensor based on HTCC with temperature compensation algorithm for extreme 1100 °C applications

被引:32
|
作者
Tan, Qiulin [1 ,2 ]
Lu, Fei [1 ]
Ji, Yaohui [1 ,2 ]
Wang, Haixing [2 ]
Zhang, Wendong [1 ,2 ]
Xiong, Jijun [1 ,2 ]
机构
[1] North Univ China, Key Lab Instrumentat Sci & Dynam Measurement, Minist Educ, Taiyuan 030051, Shanxi, Peoples R China
[2] North Univ China, Sci & Technol Elect Test & Measurement Lab, Taiyuan 030051, Shanxi, Peoples R China
基金
中国国家自然科学基金;
关键词
LC wireless sensor; Microelectronic packing technology; Extreme environment; Temperature compensation algorithm; GAS-TURBINE ENGINE;
D O I
10.1016/j.sna.2018.08.021
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A low-profile wireless and passive sensor that simultaneously realizes temperature and pressure measurement is proposed for 1100 degrees C ultra-high-temperature environmental applications. The sensor, which consists of temperature-sensitive and pressure-deformable capacitors (C) and inductors (L) based on fundamental LC resonance principle, is designed and characterized. To demonstrate feasibility in a high-temperature environment, the sensor is fabricated in high-temperature co-fired ceramic (HTCC) microelectronic packing technology with Pt metallization. The results are experimentally verified with gas pressure loading in a hermetic high-temperature tank by measuring the S(1,1) parameter of the readout antenna without contact. The integrated HTCC-based sensor works normally from 70 kPa to 120 kPa in a temperature range of 20-1100 degrees C with a maximum pressure sensitivity of 92.98 kHz/kPa and an average temperature sensitivity of 11.33 kHz/C. In order to precisely measure the pressure, we proposed an algorithm of temperature frequency compensation for pressure and decreased the temperature frequency excursion while measuring the pressure. Additionally, an HTCC embedded-cavity-forming method, namely a carbon film filled without an exhaust vent, is proposed and experimentally verified as valid. The sensor realizes pressure measurement with corresponding temperature in a specific environment, and thus, it is promising to realize practical engineering applications for ultra-high-temperature devices in future. (C) 2018 Elsevier B.V. All rights reserved.
引用
收藏
页码:437 / 446
页数:10
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