Microsolidics: Fabrication of three-dimensional metallic microstructures in poly(dimethylsiloxane)

被引：176
作者：
Siegel, Adam C. [1 ]
Bruzewicz, Derek A. [1 ]
Weibel, Douglas B. [1 ]
Whitesides, George M. [1 ]
机构：
[1] Harvard Univ, Dept Chem & Chem Biol, Cambridge, MA 02138 USA
来源：
ADVANCED MATERIALS | 2007年 / 19卷 / 05期
关键词：
D O I：
10.1002/adma.200601787
中图分类号：
O6 [化学];
学科分类号：
0703 ;
摘要：
The fabrication of complex metallic microstructures in 3D by injecting liquid solder into microfluidic channels and allowing the solder to cool and solidify is demonstrated; after fabrication, the metallic structures can be flexed, bent, or twisted (see figure and cover). With this method it is possible to build flexible electronic circuits, complex embedded or freestanding 3D metal microstructures, 3D electronic components, and hybrid electronic-microfluidic devices.
引用
收藏
页码：727 / +
页数：8
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