Interconnects - Wiring electronics with light

被引:125
作者
Alduino, Andrew [1 ]
Paniccia, Mario [1 ]
机构
[1] Intel Corp, Photon Technol Lab, Santa Clara, CA 95054 USA
关键词
D O I
10.1038/nphoton.2007.17
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
As data rates continue to spiral upwards, electrical interconnects based on copper traces and wires are struggling to keep up and optical solutions are looking increasingly attractive.
引用
收藏
页码:153 / 155
页数:3
相关论文
共 2 条
  • [1] Braunisch H, 2006, ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, P273
  • [2] Colgan EG, 2005, ELEC COMP C, P228