Mechanism of the reverse gate leakage in AlGaN/GaN high electron mobility transistors

被引:109
作者
Karmalkar, S [1 ]
Sathaiya, DM
Shur, MS
机构
[1] Indian Inst Technol, Dept Elect Engn, Madras 600036, Tamil Nadu, India
[2] Rensselaer Polytech Inst, Dept Elect Comp & Syst Engn, CII 9015, Troy, NY 12180 USA
关键词
D O I
10.1063/1.1579852
中图分类号
O59 [应用物理学];
学科分类号
摘要
The off-state gate current in AlGaN/GaN high electron mobility transistors is shown to arise from two parallel gate to substrate tunneling paths: a direct path, and a path via deep traps, which are distributed throughout the AlGaN layer and spread over an energy band. A model to calculate this current is given, which shows that trap-assisted tunneling dominates below T similar to 500 K, and direct tunneling (thermionic field emission) dominates at higher temperatures. A model fit to experimental results yields the following fabrication process sensitive parameters: trap concentration of similar to10(13)-10(15) cm(-3), and trap bandwidth of similar to50%-70% of the barrier height located 0.4-0.55 V below the conduction band edge. (C) 2003 American Institute of Physics.
引用
收藏
页码:3976 / 3978
页数:3
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