A Low-Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles

被引：128

作者：

Morisada, Y. ^{[1
]}

Nagaoka, T. ^{[1
]}

Fukusumi, M. ^{[1
]}

Kashiwagi, Y. ^{[1
]}

Yamamoto, M. ^{[1
]}

Nakamoto, M. ^{[1
]}

机构：

[1] Osaka Municipal Tech Res Inst, Joto Ku, Osaka 5368553, Japan

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2010年 / 39卷 / 08期

关键词：

Ag nanoparticles; Cu particles; bonding process; bonding strength; ionic migration resistance; MONODISPERSED SILVER NANOPARTICLES; CATALYSIS; CLUSTERS; TRANSITION; COLLOIDS; AMINE;

D O I：

10.1007/s11664-010-1195-3

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A low-temperature bonding process to form joints with high strength and ionic migration resistance using mixed Cu-Ag nanoparticles was studied. Although it was difficult to obtain strong joints using Cu nanoparticles, with the addition of Ag nanoparticles to the Cu nanoparticles the bonding strength of the Cu-to-Cu joints increased. The joints formed by the mixed Cu-Ag nanoparticles at 350A degrees C exhibited a high bonding strength of similar to 50 MPa. Counterelectrodes made of the mixed Cu-Ag nanoparticles had four times higher ionic migration resistance compared with counterelectrodes made only of Ag nanoparticles.

引用

页码：1283 / 1288

页数：6

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