Hybrid nanofluid flow around a triangular-shaped obstacle inside a split lid-driven trapezoidal cavity

被引:25
作者
Khan, Z. H. [1 ]
Khan, W. A. [2 ]
Qasim, M. [3 ]
Alharbi, S. O. [4 ]
Hamid, M. [5 ,6 ]
Du, M. [1 ]
机构
[1] Sichuan Univ, Coll Water Resource & Hydropower, State Key Lab Hydraul & Mt River Engn, Chengdu 610065, Peoples R China
[2] Prince Mohammad Bin Fahd Univ, Coll Engn, Dept Mech Engn, Al Khobar 31952, Saudi Arabia
[3] COMSATS Inst Informat Technol, Dept Math, Islamabad 22060, Pakistan
[4] Majmaah Univ, Coll Sci, Dept Math, Majmaah 11952, Saudi Arabia
[5] Fudan Univ, Dept Mech & Engn Sci, Shanghai 200433, Peoples R China
[6] Nanjing Univ Informat Sci & Technol, Sch Math & Stat, Nanjing 210044, Peoples R China
基金
中国博士后科学基金; 中国国家自然科学基金;
关键词
CONVECTION HEAT-TRANSFER; MHD MIXED CONVECTION; NONLINEAR RADIATION; SQUARE CAVITY; THERMAL-CONDUCTIVITY; GENERATION;
D O I
10.1140/epjs/s11734-022-00607-5
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
Numerical simulation analyzes the mixed convection flow of Al2O3-Cu-H2O (aluminium oxide-copper-water) hybrid nanofluid inside a split lid-driven trapezoidal cavity. A triangular-shaped cold obstacle is placed inside the cavity. The horizontal base of the cavity is kept cold, whereas the side walls are chosen adiabatic. The thermally active upper wall maintained at a constant temperature is split into halves, and each half moves opposite to the other with constant velocity. Modeled equations are converted into a nonlinear system of partial differential equations. This system, along with incorporated physical boundary constraints, is solved numerically via Galerkin finite-element method. Attained results are also compared with the earlier publications to ensure validation and accuracy. To examine the effects of various pertinent parameters, various flow and heat transfer attributes like dimensionless velocity, stream contours, temperature, and isotherms, and local and average Nusselt numbers are critically analyzed. The outcomes of this examination will provide qualitative suggestions to improve the cooling mechanism of several electronic gadgets and thermal devices.
引用
收藏
页码:2749 / 2759
页数:11
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