Atomic-scale imaging and the effect of yttrium on the fracture toughness of silicon carbide ceramics

被引：27

作者：

Kueck, A. M. ^{[1
,2
]}

Ramasse, Q. M. ^{[3
]}

De Jonghe, L. C. ^{[1
,2
]}

Ritchie, R. O. ^{[1
,2
]}

机构：

[1] Univ Calif Berkeley, Dept Mat Sci & Engn, Berkeley, CA 94720 USA

[2] Lawrence Berkeley Natl Lab, Div Mat Sci, Berkeley, CA 94720 USA

[3] Lawrence Berkeley Natl Lab, Natl Ctr Electron Microscopy, Berkeley, CA 94720 USA

来源：

ACTA MATERIALIA | 2010年 / 58卷 / 08期

关键词：

Ceramics; Silicon carbide; Yttrium dopants; Fracture toughness; B-C ADDITIONS; MECHANICAL-PROPERTIES; PHASE-TRANSFORMATION; OXYNITRIDE GLASSES; MICROSTRUCTURE; BEHAVIOR; NITRIDE; FATIGUE; OXYCARBIDE; BETA-SI3N4;

D O I：

10.1016/j.actamat.2010.01.031

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In SiC sintered with Al, B and C additions (ABC-SiC), the presence of Y in the Al-Si-O-C grain-boundary phase leads to less frequent crack deflection and lower toughness When Y is absent from the grain-boundary phase and remains in the triple pockets, crack deflection is restored, and higher toughness results from grain-bridging mechanisms The observations are consistent with elastic modulus changes in the intergranular phase, which depend on their yttria and silica content, and indicate that these can play an important role in determining crack deflection While high-toughness ceramics such as ABC-SiC and Si3N4 rely on sintering additives forming crack-deflecting intergranular films, the present case is a striking example where the presence of a segregant in the grain boundary promotes transgranular fracture by raising the modulus of the nanoscale mtergranular grain-boundary film (C) 2010 Acta Materialia Inc Published by Elsevier Ltd All rights reserved

引用

页码：2999 / 3005

页数：7

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