Development of Heat Pipes for Cooling Thermally Stressed Electronics Elements

被引：11
作者：
Delendik, K., I [1 ]
Kolyago, N., V [1 ]
Penyazkov, O. G. [1 ]
Voitik, O. L. [1 ]
机构：
[1] Natl Acad Sci Belarus, AV Luikov Heat & Mass Transfer Inst, 15 P Brovka Str, Minsk 220072, BELARUS
来源：
JOURNAL OF ENGINEERING PHYSICS AND THERMOPHYSICS | 2019年 / 92卷 / 06期
关键词：
heat pipe; wick; thermal resistance; light-emitting diode; cooling system; radiator;
D O I：
10.1007/s10891-019-02073-8
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
An algorithm for the development of heat pipes involving the choice of the working fluid, materials for the casing and wick, and the methods of calculating the limits of heat-transmitting ability of heat pipes is suggested. This algorithm has been applied successfully for creating different types of wicks and heat pipes on the basis of which a cooling system has been created for a high-power light-emitting diode lantern.
引用
收藏
页码：1529 / 1536
页数：8
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