A simple method to qualify the LDD structure against the early mode of hot-carrier degradation

被引:16
|
作者
Raychaudhuri, A
Deen, MJ
King, MIH
Kwan, WS
机构
[1] SIMON FRASER UNIV, SCH ENGN SCI, BURNABY, BC V5A 1S6, CANADA
[2] NO TELECOM ELECT LTD, TELECOM MICROELECTR CTR, NEPEAN, ON K2H 8V4, CANADA
基金
加拿大自然科学与工程研究理事会;
关键词
D O I
10.1109/16.477600
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A simple combination of the heating gate technique and measurements of the forward and reverse (source and drain interchanged) saturation I-DS versus V-GS characteristics for an LDD NMOSFET is shown to reveal more information on the nature of an early hot-carrier degradation. Any susceptibility of the LDD structure to this type of degradation leads to an early evolution of the floating gate drain current, and a corresponding evolution in the I-DS versus V-GS curves mentioned above, without affecting the threshold voltage, Our method reveals that the early mode affects both forward and reverse saturation I-DS versus V-GS characteristics, While the effect on the reverse characteristic can he attributed to an increase in the drain parasitic resistance, the effect on the forward characteristic apparently indicating source side activity, may be actually due to an increase in the effective channel length, as suggested by simulations, an additional new observation of the decrease of the peak substrate current with the floating gate cycles, when coupled with simulations, allow us to locate and quantify the damage at the edge of the gate, We expect our observations to be useful in qualifying the LDD structure.
引用
收藏
页码:110 / 115
页数:6
相关论文
共 50 条
  • [21] A VCO test structure for characterizing AG hot-carrier degradation
    Koike, N
    Tatsuuma, K
    1996 INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP FINAL REPORT, 1996, : 62 - 65
  • [22] Two-stage hot-carrier degradation and its impact on submicrometer LDD NMOSFET lifetime prediction
    Massachusetts Inst of Technology, Cambridge, United States
    IEEE Trans Electron Devices, 5 (957-962):
  • [23] A new insight into the degradation behavior of the LDD N-MOSFET during dynamic hot-carrier stressing
    Ang, DS
    IEEE ELECTRON DEVICE LETTERS, 2001, 22 (11) : 553 - 555
  • [24] 2-STAGE HOT-CARRIER DEGRADATION AND ITS IMPACT ON SUBMICROMETER LDD NMOSFET LIFETIME PREDICTION
    CHAN, VH
    CHUNG, JE
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1995, 42 (05) : 957 - 962
  • [25] On the Temperature Behavior of Hot-Carrier Degradation
    Tyaginov, S.
    Jech, M.
    Sharma, P.
    Franco, J.
    Kaczer, B.
    Grasser, T.
    2015 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP (IIRW), 2015, : 143 - 146
  • [26] A NOVEL HOT-CARRIER RELIABILITY MONITOR FOR LDD P-MOSFETS
    PAN, Y
    NG, KK
    KWONG, V
    SOLID-STATE ELECTRONICS, 1994, 37 (12) : 1961 - 1965
  • [27] A new characterization method for hot-carrier degradation in DMOS transistors
    Pieracci, A
    Ricco, B
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1998, 45 (08) : 1855 - 1858
  • [28] Monitoring hot-carrier degradation in SOI MOSFET's by hot-carrier luminescence techniques
    Selmi, L
    Pavesi, M
    Wong, HSP
    Acovic, A
    Sangiorgi, E
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1998, 45 (05) : 1135 - 1139
  • [29] HOT-CARRIER STRESSING DAMAGE IN WIDE AND NARROW LDD NMOS TRANSISTORS
    BOURCERIE, M
    DOYLE, BS
    MARCHETAUX, JC
    BOUDOU, A
    MINGAM, H
    IEEE ELECTRON DEVICE LETTERS, 1989, 10 (03) : 132 - 134
  • [30] ANOMALOUS HOT-CARRIER BEHAVIOR FOR LDD P-CHANNEL TRANSISTORS
    DOYLE, BS
    MISTRY, KR
    IEEE ELECTRON DEVICE LETTERS, 1993, 14 (11) : 536 - 538