Performance of a GaAs-Based Pseudomorphic Transistor with the Electroless-Plated Surface Treated Gate

被引:4
作者
Chen, Li-Yang [1 ]
Chen, Huey-Ing [3 ]
Cheng, Shiou-Ying [2 ]
Tsai, Tsung-Han [1 ]
Liu, Yi-Jung [1 ]
Huang, Chien-Chang [1 ]
Chen, Tai-You [1 ]
Hsu, Chi-Hsiang [1 ]
Liu, Wen-Chau [1 ]
机构
[1] Natl Cheng Kung Univ, Dept Elect Engn, Inst Microelect, Tainan 70101, Taiwan
[2] Natl Ilan Univ, Dept Elect Engn, Ilan 26041, Taiwan
[3] Natl Cheng Kung Univ, Dept Chem Engn, Tainan 70101, Taiwan
关键词
aluminium compounds; atomic force microscopy; Auger electron spectra; electrodeposition; electrodeposits; gallium arsenide; III-V semiconductors; indium compounds; leakage currents; scanning electron microscopy; Schottky barriers; semiconductor-metal boundaries; surface treatment; thin film transistors; transistors; METAMORPHIC HEMTS; COMPREHENSIVE CHARACTERIZATION; RELIABILITY; MODEL;
D O I
10.1149/1.3289730
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
An interesting GaAs-based pseudomorphic transistor with an electroless-plated (EP) surface treated gate is fabricated and studied. Based on the low temperature and low energy electrochemical deposition conditions, the EP deposition approach can form a better metal-semiconductor interface with the reduction of surface thermal damages and disordered states. The material analyses of the EP deposition approach, including Auger electron spectroscopy, scanning electron microscopy, and atomic force microscopy, are examined. The device characteristics including dc, microwave, and reliability performances are investigated. In addition, the temperature influences of the studied devices, at the temperature regime of 300-500 K, are studied. As compared with the conventional thermal evaporation approach, the EP-based device shows significantly improved dc characteristics over a wide temperature range (300-500 K). Moreover, the EP approach also has the advantages of easy operation and low cost.
引用
收藏
页码:H408 / H413
页数:6
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